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1.5 - 2.5 GHz Upconverter/ Downconverter Technical Data
HPMX-5001
Features
* 2.7 V Single Supply Voltage * Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical) * 2 dBm Typical Transmit Power at 1900 MHz * Half-Frequency VCO with Frequency Doubler * 32/33 Dual-Modulus Prescaler * Flexible Chip Biasing, Including Standby Mode * TQFP-32 Surface Mount Package * Operation to 2.5 GHz * Use with Companion HPMX-5002 IF chip
Plastic TQFP-32 Package
General Description
The HPMX-5001 Upconverter/ Downconverter provides RF system designers with all of the necessary features to perform an RF-to-IF downconversion for a receive path, as well as an IF-toRF upconversion for transmit mode. Designed to meet the unique needs of portable applications, the HPMX-5001 combines the qualities of flexible chip biasing, low power consumption, and true 2.7 V minimum supply voltage operation to provide superior performance and battery life. By incorporating the active elements of the VCO on-chip, as well as a 32/33 dual-modulus prescaler, overall system component count and costs are decreased. The 32-TQFP package insures that this high level of integration occupies a small amount of printed circuit board space. The HPMX-5001 can be used in either dual-conversion systems (with the HPMX-5002 IF Demodulator/Modulator) or single-conversion systems. The HPMX-5001 is manufactured using Hewlett-Packard's HP-25 Silicon Bipolar Process with 25 GHz f T and 30 GHz fMax.
-5001 HPMX WW YY ZZZ XXXX
H
Pin Configuration
32 1 25 24
H
HPMX-5001 YYWW XXXX
8 9 16
Applications
* DECT, UPCS and ISM Band Handsets and Basestations
ZZZ
17
Functional Block Diagram
RX IF OUT POWER DOWN CONTROL
RX RF IN EXT. VCO TANK
X2
TX RF OUT 32/33 RATIO SELECT
TX IF IN
PRESCALER OUT
5965-9105E
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HPMX-5001 Absolute Maximum Ratings[1]
Parameter VCC Supply Voltage Voltage at Any Pin[4] Power Dissipation[2,3] RF Input Power Junction Temperature Storage Temperature Min. -0.2 V -0.2 V Max. 8V VCC + 0.2 V 600 mW 15 dBm +150C +125C
Thermal Resistance[2]: jc = 100C/W
Notes: 1. Operation of this device in excess of any of these parameters may cause permanent damage. 2. TCASE = 25C. 3. Derate at 10 mW/C for TCASE > 90C. 4. Except CMOS logic inputs - see Summary Characterization Information table.
-55C
HPMX-5001 Guaranteed Electrical Specifications
Unless otherwise noted, all parameters are guaranteed under the following conditions: VCC = 3.0 V. Test results are based upon use of networks shown in test board schematic diagram (see Figure 28). Typical values are for VCC = 3.0 V, TA = 25C. Symbol GC Pout ICC Parameters and Test Conditions Receive Conversion Gain[1] Transmitter Power Output Input[2] 2:1 output VSWR Device Supply Current Transmit Mode Receive Mode Synth Mode Standby Mode (with DIVMC Set High) DIV Single-Ended Swing[3] Units dB dBm mA mA mA A VPP Min. 12 0 Typ. 14 2 64 43 15 1 1 Max.
80 54 19 50
VDIV
0.7
Notes: 1. 50 RF source, 100 MHz < IF < 300 MHz, 1.89 GHz RF. There is a 750 resistor on chip between RXIF and RXIFB (pins 3 and 4). A matching network from 750 to 50 is used for this measurement. Insertion loss of the matching network is included in the net conversion gain figure. See Figure 28. 2. Signal injected into P3 in Figure 28 is -12.5 dBm. 3. DIV output AC coupled into a 2 k || 10 pF load. See test board schematic diagram, Figure 28.
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HPMX-5001 Summary Characterization Information
Typical values measured on test board shown in Figure 28 at VCC = 3.0 V, TA = 25C, RXIF = 110.592 MHz, TXRF = 1.89 GHz, unless otherwise noted. Symbol VIH VIL IIH IIL ts th tpd Receive Mode Gc NF IIP3 IP1dB Parameters and Test Conditions CMOS Input High Voltage (Can Be Pulled up as High as VCC + 7 V)[1] CMOS Input Low Voltage CMOS Input High Current CMOS Input Low Current DIVMC Setup Time[2,8] DIVMC Hold Time[2,8] DIV Propagation Delay[2,8] Mode Switching Time[3] Receive Conversion Gain [9] Noise Figure[4] Input Third Order Intercept Point Input 1 dB Gain Compression Point LO Leakage (2 x fVCO) at IF Port Input VSWR[5] Units V V A A ns ns ns s dB dB dBm dBm dBm Typical VCC - 0.8 VCC - 1.9 <10 >-300 4 0 <7 <1 1.89 GHz 2.45 GHz 14 13.5 10 10 -8 -9 -18 -18 -57 -- 1.3:1 1.3:1 -- 0 1.8:1 25 500 +137 750-1200 -5 0 1.8:1 30 500 +134
VSWRin Transmit Mode[6] PIM 3 Power Output Level for >35 dB IM3 Suppression[10] OP1dB Output 1 dB Gain Compression Point VSWRout Output VSWR LO Suppression (2 x fVCO) F3dBIF IF 3 dB Bandwidth Transmitter C/N @ 2 x fVCO + 4 MHz[11] Synth Mode 1LO Frequency Range[7]
dBm dBm dBc MHz dBc/Hz MHz
Notes: 1. All CMOS logic inputs are internally pulled up to logic high level. 2. See Figure 2 for detailed timing diagram. 3. Between any two different biasing modes. This switching time does not include PLL lock-up time. 4. Single sideband noise figure. 5. In modes other than receive, the VSWR may be as high as 10:1. 6. Single-ended 50 RF load, 300 series IF terminations (600 differential), 100 MHz < IF < 300 MHz, 1.89 GHz RF. 7. The LO is followed by a frequency doubler which raises the LO range to 1500-2400 MHz. 8. DIV output AC coupled into a 2 k || 10 pF load. See test diagram, Figure 28. 9. 50 RF source, 110 MHz < IF < 300 MHz, 1.89 GHz or 2.45 GHz RF. There is a 750 resistor on chip between RXIF and RXIFB (pins 3 and 4). A matching network from 750 to 50 is used for this measurement. Insertion loss of the matching network is included in the net conversion gain figure. 10. PIM3 is the maximum SSB output power for at least 35 dB IM3 spur suppression. 11. Measured at saturated output power for 1.89 GHz. Measured at -5 dBm SSB output power for 2.45 GHz.
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Table 1 - HPMX-5001 Pin Description
No. 1 3 4 5 6 7 8 10 11, 15 12 14 16 17 20 21 22 23 26 27 28 30 31 32 2, 9, 13, 18,19,24, 25, 29 Mnemonic TXCTRL RXIFB RXIF TXIF TXIFB LNAREF RXRF TXRXVCC TXRXGND TXRFB TXRF DBLVCC DBLGND VCOTNKS VCOTNKF VCOVCC VCOGND DIVVCC DIVGND DIV DIVMC LOCTRL RXCTRL VSUB I/O Type CMOS I/P Analog O/P Analog O/P Analog I/P Analog I/P Analog DC I/P Analog I/P DC Supply Ground Analog O/P Analog O/P DC Supply Ground Analog I/P Analog O/P DC Supply Ground DC Supply Ground Analog O/P CMOS I/P CMOS I/P CMOS I/P Ground Description Controls biasing of transmit mixer, amplifiers, and doubler Inverted single-ended downconverted receiver output, normally tied to VCC (internal 750 resistor connects to RXIF) Single-ended downconverted receiver output, drives SAW filter (internal 750 resistor connects to RXIFB) Transmit non-inverting IF input Transmit inverting IF input Reference input for receive input amplifier Receive RF input Supply voltage for transmit path, receive front-end and mixer Ground for transmit path, receive front-end and mixer Inverting output of transmit path (see test diagram for matching network) Non-inverting output of transmit path (see test diagram for matching network) Supply voltage for LO frequency doubler Ground for LO frequency doubler Sense line from external tank circuit to on-chip VCO amplifier Force line from on-chip VCO amplifier to external tank circuit Supply voltage for on-chip VCO amplifier Ground for on-chip VCO amplifier Supply voltage for 32/33 dual-modulus prescaler Ground for 32/33 dual-modulus prescaler Output from 32/33 dual-modulus prescaler Modulus control signal for 32/33 dual-modulus prescaler Controls biasing for VCO and 32/33 dual modulus prescaler Controls biasing for receive mixer, amplifiers, and doubler Substrate bias voltage
Table 2 - HPMX-5001 Mode Control
(CMOS Logic Levels - all pins internally pulled up to high level) Mode Transmit Receive Synth Standby TXCTRL 0 1 1 1 RXCTRL 1 0 1 1 LOCTRL 0 0 0 1
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31 VCO
32
1
2
16
17
18
19
32
33
1
2
DIV
DIVMC DIVIDE BY 33 (DIVMC = 0)
31 VCO
33
1
2
16
17
18
19
32
1
2
3
DIV
tpd
DIVMC ts th
DIVIDE BY 32 (DIVMC = 1)
Figure 2. HPMX-5001 Prescaler Timing Diagram.
TX PA
CERAMIC TX FILTER
TX IF INPUT
LO1 T/R FRONT-END RF FILTER RX LNA 32/33 CERAMIC IMAGE FILTER HPMX-5001 X2 TANK
REFERENCE OSCILLATOR
30 MHz SYNTHESIZER
RX IF FILTER
RX IF OUTPUT
Figure 3. HPMX-5001 Block Diagram/Typical Application.
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TX PA
CERAMIC TX. FILTER LO1 900 MHz 10.368 MHz REFERENCE OSCILLATOR
T/R FRONT-END RF FILTER RX LNA
X2
TANK
32/33 CERAMIC IMAGE FILTER HPMX-5001 IF1 = 110.592 MHz SAW CHANNEL FILTER IF2 = 6.912 MHz LC FILTER LC FILTER CHARGE PUMP DATA FILTER
30 MHz SYNTHESIZER
DATA SLICER RSSI 90/216 CHARGE PUMP o FREQ. DET. LOCK DET. 9/12/16
RX DATA
TANK LO2 = 103.68 MHz
RC FILTER TX DATA LC FILTER
Figure 4. Typical HPMX-5001 Application with HPMX-5002 IF Chip. All Other Connections Go to Burst Mode Controller, Power Source, or Ground.
12 10 VCC = 5.5 V 8 6 4 2 0 -55 -35 VCC = 2.7 V -15 5 25 45 65 85 TEMPERATURE (C)
48 46 44 VCC = 3.0 V 42 40 38 36 -55 -35 VCC = 2.7 V
17
VCC = 5.5 V
ICC SYNTHESIZER MODE (mA)
ICC STANDBY MODE (A)
ICC RECEIVE MODE (mA)
16
VCC = 5.5 V VCC = 3.0 V VCC = 2.7 V
VCC = 3.0 V
15
14
-15
5
25
45
65
85
13 -55 -35
-15
5
25
45
65
85
TEMPERATURE (C)
TEMPERATURE (C)
Figure 5. ICC in Standby Mode vs. Temperature and VCC.
Figure 6. ICC in Receive Mode vs. Temperature and VCC.
Figure 7. ICC in Synthesizer Mode vs. Temperature and VCC.
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70
ICC TRANSMIT MODE (mA)
2.0
2.0
65 VCC = 3.0 V
1.6
RXRF VSWR (OUTPUT)
RXRF VSWR (INPUT)
VCC = 5.5 V
1.8
1.8
1.6
60
VCC = 2.7 V
1.4 VCC = 2.7 V VCC = 5.5 V
1.4 VCC = 2.7 V VCC = 5.5 V
1.2
1.2
55 -55 -35
-15
5
25
45
65
85
1.0 -55 -35
-15
5
25
45
65
85
1.0 -55 -35
-15
5
25
45
65
85
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
Figure 8. ICC in Transmit Mode vs. Temperature and VCC.
Figure 9. Receive Downconverter Input VSWR vs. Temperature and VCC.
Figure 10. Receive Downconverter Output VSWR vs. Temperature and VCC.
RECEIVE MIXER SSB NOISE FIGURE (dB)
12 10 8 6 4 2 0 -55 -35 VCC = 5.5 V VCC = 2.7 V
0
RECEIVE MIXER CONVERSION GAIN (dB)
15.0 14.5 14.0 13.5 13.0 12.5 12.0 -55 -35 VCC = 5.5 V
RECEIVE MIXER (dBm)
-5 INPUT IP3 -10 VCC = 2.7 V VCC = 5.5 V
VCC = 2.7 V
-15 P1dB -20
-15
5
25
45
65
85
-25 -55 -35
-15
5
25
45
65
85
-15
5
25
45
65
85
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
Figure 11. Receive Downconverter SSB Noise Figure vs. Temperature and VCC.
Figure 12. Receive Downconverter Input Third Order Intercept Point and Output 1 dB Compression Point vs. Temperature and VCC.
Figure 13. Receive Downconverter Conversion Gain vs. Temperature and VCC.
TRANSMIT 2 x fLO SUPPRESSION (dBc)
0 -10
40 35 30 25 20 15 10 5 0 -55 -35 -15 5 25 45 65 85
3.0
2 x fLO LEAKAGE (dBm)
-20 -30 -40 VCC = 5.5 V -50 VCC = 2.7 V -60 -70 -55 -35 -15 5 25 45 65 85
TXRF VSWR (OUTPUT)
VCC = 2.7 V
2.6
VCC = 5.5 V
2.2
VCC = 2.7 V VCC = 5.5 V
1.8
1.4
1.0 -55 -35
-15
5
25
45
65
85
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
Figure 14. 2 x fLO Leakage at Receive Downconverter Output vs. Temperature and VCC.
Figure 15. 2 x fLO Suppression at Transmit Upconverter Output vs. Temperature and VCC.
Figure 16. Transmit Upconverter Output VSWR vs. Temperature and VCC.
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TRANSMIT CARRIER TO NOISE RATIO (dB)
138.0 VCC = 5.5 V 137.5 137.0 136.5 136.0 135.5 135.0 -55 -35 VCC = 2.7 V
3.0 2.0 POUT 1.0 0 -1.0 -2.0 -3.0 -55 -35 VCC = 5.5 V
DIV OUTPUT (Vp-p)
1.05 VCC = 3.0 V 1.00 VCC = 5.5 V 0.95 VCC = 2.7 V
TRANSMIT MIXER (dBm)
P1dB VCC = 2.7 V
0.90
-15
5
25
45
65
85
-15
5
25
45
65
85
0.85 -55 -35
-15
5
25
45
65
85
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
Figure 17. Carrier to Noise Ratio at Transmit Upconverter Output vs. Temperature and VCC.
Figure 18. Transmit Upconverter Power Output and Output 1 dB Compression Point vs. Temperature and VCC.
Figure 19. Prescaler Output Voltage vs. Temperature and VCC.
DIVVCC PIN 26 RECOMMENDED OUTPUT CIRCUIT C = 2.2 nF, R = 51 PIN 28 DIV o/p C R
MAX. LOAD C = 10 pf, R = 2k PIN 27 DIVGND
Figure 20. Equivalent Circuit and Recommended Output and Load Circuits for the HPMX-5001 Prescaler Output.
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DIVVCC PIN 26
PIN 30 DIVMC i/p
LOW = 1/33 OPEN OR VCC = 1/32 PIN 27 DIVGND
Figure 21. Equivalent Circuit for the Divider Modulus Control.
VCOVCC , PIN 22 TO USE WITH INJECTED LO SIGNAL, DRIVE PIN 20 (VCOTNKS) WITH 630 m Vp-p. LEAVE PIN 21 (VCOTNKF) FLOATING AS SHOWN BELOW. C = 22 p MAX. FOR MINIMAL TURN ON DELAYS. 20 PIN 21 OPTIONAL FOR SWR 21
7k PIN 20
VCOGND, PIN 23
Figure 22. Equivalent Circuit for VCO Tank Connection and Recommended Tank Circuit.
VCC
ALL LOGIC CONTROL PINS ARE ACTIVE LOW. OPEN OR VCC = NOT ACTIVE.
TXCTRL, PIN 1 LOCTRL, PIN 31 RXCTRL, PIN 32
GND
Figure 23. Equivalent Circuit for Logic Control Pin 1, 31, and 32.
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TXRX VCC 10 BIAS TO MIXER RXRF 50 i/p 2.7 pF 8 BIAS
LNAREF 7 11 3.3 pF LNA STAGE PCB GND 15 TXRX GND EXTERNAL COMPONENTS ARE FOR TYPICAL i/p SWR OF 1.3:1 OVER 1.85 TO 2.55 GHz
Figure 24. Equivalent Circuit for RXRF Input.
TXRX VCC 10 RECOMMENDED DRIVE LEVEL IS 300 mV pk-pk. 10 k TXIF 5 10 k
TXIF IN
TXIFB 6 USE d.c. BLOCKING Cs TO AVOID CHANGING d.c. BIAS CONDITIONS. 22 pF MAX. FOR QUICK TURN ON. 11/15 TXRX GND
TX i/p STAGE
Figure 25. Equivalent Circuit for TXIF Input.
VCC
3 RXIFB 750 4 RXIF 120 nH
6.8 pF 8.2 pF 50 o/p
LO EXTERNAL COMPONENTS SHOWN ARE FOR 110.592 MHz I.F. AND TYPICAL 50 o/p SWR OF 1.3:1 RF
11/15 TXRX GND
Figure 26. Equivalent Circuit for the RXIF Output and Recommended Matching Circuit for 110.592 MHz IF.
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VCC 3.3 nH 50
12
TXRFB 300 14 TXRF 22 pF EXAMPLE o/p NETWORK FOR 1.88-1.90 GHz. OTHER SYMMETRIC NETWORKS WILL ENABLE OPERATION UP TO 2.50 GHz. 11/15 TX o/p STAGE TXRX GND 3.3 nH 50 o/p
Figure 27. Equivalent Circuit for TXRF Output and Matching Network for DECT Phone Operation.
P9 R8
P8 R7
P7 R5
R9 P10 C12 32
C11
C10 C9
25
R10 P1 C13
1 + 32/33
24
C1 C2 RXIF
L1 R4 C3 X2 R1 R6 VCOTNKS C8
TXIF T1 C4
C5 RXRF C6 8 17
9 VCC Ground R2 L2
16
X3 L3
C7
TXRF
Figure 28. Test Board Schematic Diagram. All I/O Labels Correspond to Those on the Test board. See Table 3 for Component Values.
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Table 3. Test Board Components Shown in Figure 28.
Note: Required VCC decoupling capacitors are not shown on the schematic. Detailed schematic and board layout are available in Application Note 1081. Component Label R1 R2, R4, R5 X3 R6 R7, R8, R9, R10 C1 C2 C3, C4, C10, C11, C12, C13 C5 C6 C7 C8 C9 L1 L2, L3 T1 Value (Size) 270 (0805) 51.1 (0805) R = 300 (0805) for 1.89 GHz, L = 3.3 nH for 2.45 GHz 20 (0805) 1100 (0805) see Table 4 see Table 4 1 nF (0805 or 0504) 3.3 pF (0504 or 0603) 2.7 pF (0805) 22 pF (0805) for 1.89 GHz, 3.3 pF for 2.45 GHz 12 pF (0805 or 0504) 2.2 nF (0805) see Table 4 3.3 nH (0805) 1:4 Balun T4-1-X65
Functional Description
A typical DECT application of the HPMX-5001 in a dual-conversion superheterodyne radio transceiver is shown in Figure 3. The HPMX-5001 is designed to provide four different modes of operation: * Transmit, where the VCO, doubler, upconverting mixer, associated buffers, and prescaler are enabled * Receive, where the VCO, doubler, downconverting mixer, associated buffers, and prescaler are enabled * Synthesizer, where only the VCO and prescaler are active * Standby, where all circuits are disabled These four modes are controlled via a three wire interface, TXCTRL, RXCTRL, and LOCTRL. Figure 1 shows the programming logic states for all four modes. The detailed description of the three active modes is given below.
Table 4. Component changes for dfferent IF frequencies.
IF Frequency 110 MHz 200 MHz 250 MHz 300 MHz 350 MHz C1, pF 6.8 1.0 1.2 1.2 2.7 C2, pF 8.2 3.9 3.9 3.9 2.7 L1, nH 120 100 56 39 27 VSWR 1.3:1 1.3:1 1.3:1 1.3:1 1.3:1
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Transmit Mode For transmit upconversion, a differential narrow-band modulated signal is AC-coupled into the TXIF and TXIFB inputs. The differential signal may be generated by the HPMX-5002 IF Demodulator/Modulator. Once on-chip, the signal is buffered and applied to a double-balanced Gilbert cell mixer. The upconverted RF signal is then amplified to generate a -0.6 dBm single-ended, single-sideband power signal at the 1 dB compression point. The RF outputs, TXRF and TXRFB, are open-collector outputs (see test diagram Figure 28 for recommended matching network). The TXRF output is AC-coupled into a 50 transmit filter. This signal is then filtered and amplified offchip by an external power amplifier before it is switched into the antenna. The HPMX-5001 may also be used in DECT systems which utilize direct modulation of the 1LO for data transmission. In this case, either the TXIF or TXIFB input, but not both, must be tied to VCC to cause the upconverting mixer to act as a buffer stage.
Receive Mode In receive mode, a preamplified RF signal is passed through an image filter and applied as a single-ended signal to the 50 RXRF input. Use of a 2.7 pF blocking capacitor is recommended. RXRF is the noninverting input of the RF input amplifier. The inverting input of this amplifier, LNAREF, is selfbiased and requires only an external capacitor (recommended value of 3.3 pF) to ground. The receive downconversion mixer also employs a double-balanced Gilbert cell configuration. The production version of the HPMX-5001 will have two equivalent open collector outputs. The HPMX-5001 can operate at IF frequencies up to 300 MHz (see Figure 28 for recommended matching network). Synthesizer Mode The on-chip 32/33 dual-modulus prescaler, in conjunction with the VCO, external tank circuit, and CMOS synthesizer, form a phaselocked loop (PLL). The prescaler divider output and modulus control input are designed to be compatible with positive-edge
triggered CMOS synthesizers from a variety of vendors. The timing requirements for the prescaler are shown in Figure 2. It is important to note that the prescaler divides the VCO signal, and not the frequency doubler output. Local oscillator (LO) signal generation on the HPMX-5001 is accomplished through the combination of a VCO and frequency doubler. The VCO is a simple Clapp oscillator for the best possible noise performance. The VCO force and sense pins (VCOTNKF, VCOTNKS) are self-biased, so that the connections to the tank (minimum Q of 20) are through AC-coupling capacitors. VCOTNKS can also be used with an injected LO. VCOTNKF would then be left floating. The doubler circuit multiplies the VCO frequency by two. This enables the VCO to have lower sensitivity to both package parasitics and LO re-radiation. Separate bias pins and buffering are utilized to minimize pulling of the VCO when the chip is switched from synthesizer to transmit or receive mode.
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Part Number Ordering Information
Part Number HPMX-5001-STR HPMX-5001-TR1 HPMX-5001-TY1 No. of Devices 10 1000 250 Container Strip Tape and Reel Tray
Package Dimensions 32 Pin Thin Quad Flat Package
All dimensions shown in mm.
9.0 0.25 7.0 0.1
9.0 0.25
HPMX-5001 YYWW XXXX ZZZ
7.0 0.1
0.35 TYP.
0.8
1.4 0.05
0.6
+ 0.15 - 0.10
0.05 MIN., 0.1 MAX.
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Tape Dimensions and Product Orientation for Outline TQFP-32
REEL
CARRIER TAPE USER FEED DIRECTION COVER TAPE
2.0 (See Note 7) 0.30 0.05 4.0 (See Note 2) 1.5+0.1/-0.0 DIA 1.75
R 0.5 (2) 1.6 (2) 5.0 BO 7.5 (See Note 7) 16.0 0.3
HPMX-5001
K1 KO 1.5 Min.
6.4 (2) AO 12.0
Cover tape width = 13.3 0.1 mm Cover tape thickness = 0.051 mm (0.002 inch)
NOTES: 1. Dimensions are in millimeters 2. 10 sprocket hole pitch cumulative tolerance 0.2 3. Chamber not to exceed 1 mm in 100 mm 4. Material: black conductive AdvantekTM polystyrene 5. AO and BO measured on a plane 0.3 mm above the bottom of the pocket. 6. KO measured from a plane on the inside bottom of the pocket to the top surface of the carrier. 7. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
AO = 9.3 mm BO = 9.3 mm KO = 2.2 mm K1 = 1.6 mm
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